BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework Kit for 9mm to 43mm BGA Chip
BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework Kit for 9mm to 43mm BGA Chip
BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework Kit for 9mm to 43mm BGA Chip
BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework Kit for 9mm to 43mm BGA Chip
BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework Kit for 9mm to 43mm BGA Chip
BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework Kit for 9mm to 43mm BGA Chip
BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework Kit for 9mm to 43mm BGA Chip
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BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework Kit for 9mm to 43mm BGA Chip
BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework Kit for 9mm to 43mm BGA Chip
BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework Kit for 9mm to 43mm BGA Chip
BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework Kit for 9mm to 43mm BGA Chip
BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework Kit for 9mm to 43mm BGA Chip
BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework Kit for 9mm to 43mm BGA Chip
BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework Kit for 9mm to 43mm BGA Chip
Efficient BGA Rework: Our BGA Reballing Rework Station, equipped with a diagonal universal stencil, allows for precise and efficient BGA IC reballing using solder paste.
BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework Kit for 9mm to 43mm BGA Chip
Numéro d'article: 108819499

BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework

98% des répondants recommanderaient ceci à un ami

Numéro d'article: 108819499

XOF 30544

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Efficient BGA Rework: Our BGA Reballing Rework Station, equipped with a diagonal universal stencil, allows for precise and efficient BGA IC reballing using solder paste.
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Ce qui se démarque

Versatile Stencil Design
The diagonal universal stencil accommodates a wide range of BGA chip sizes from 9mm to 43mm, enhancing usability for different IC reballing tasks and giving technicians flexibility in their repair processes.
Durable Material
Constructed from high-quality aluminum alloy, this rework station ensures longevity and reliability, preventing wear and tear over time and offering consistent performance for all BGA reballing jobs.
Efficient Soldering Kit
Designed to streamline the reballing process, the included solder paste enhances adhesion and performance, making it a superior choice for professionals seeking effective solutions for BGA rework challenges.

Détails du produit

Shop BGA Reballing Rework Station, BGA Reballing Station Diagonal Universal Stencil for Bga IC Reballing Use Solder Paste Aluminum Alloy Soldering Rework Kit for 9mm to 43mm BGA Chip online at a best price in Togo. B0DDL5VW3V
Brand Nameplplaaoo
Included ComponentsNo
Unit Count1 Count
Item Type NameSoldering Stations
Manufacturerplplaaoo
Model Numberplplaaooa2tkp4v5q7
Manufacturer Part Numberplplaaooa2tkp4v5q7
Brandplplaaoo
Item Weight3 lbs (1.36 kg)

À qui est-ce destiné ?

Suitable For
  • Professional Technicians

    Ideal for technicians who regularly repair BGA IC components and require precision reballing tools.

  • Hobbyist Enthusiasts

    Perfect for electronics hobbyists looking to engage in BGA rework projects at home with ease.

  • Small Repair Shops

    Beneficial for small electronics repair shops needing a versatile solution for BGA chip reballing.

Not Suitable For
  • Beginner Users

    Not suitable for beginners without prior experience in BGA reworking due to complexity.

DESCRIPTION DU PRODUIT

Vous avez une question ? Chattez avec nous

Questions et réponses des clients

  • question: What is a BGA Reballing Rework Station?

    répondre: A BGA Reballing Rework Station is a specialized tool used for the reballing process of BGA (Ball Grid Array) integrated circuits. This device aids in removing and replacing solder balls on a BGA chip, crucial for repairing damaged connections and ensuring optimal performance. It typically includes features like temperature control and alignment mechanisms for precise operation. This tool is essential for technicians dealing with electronics that require high reliability, such as in computer hardware or mobile devices.
  • question: What are the main components of a BGA Reballing Station?

    répondre: The main components of a BGA Reballing Station include a reflow oven, a stencil for applying solder paste, and tools for aligning the BGA IC with the PCB. The reflow oven heats the solder to the melting point, while the stencil ensures even application of solder paste to the chip. This setup is crucial for professionals in the electronics repair industry, enabling accurate and efficient repairs on circuit boards, ensuring that devices function correctly after reballing.
  • question: Can this station be used for any type of BGA IC?

    répondre: Yes, the BGA Reballing Rework Station is designed to handle various types and sizes of BGA ICs. With adjustable settings and universal stencils, it can cater to different specifications, making it versatile for different electronic repair tasks. This is particularly useful in a repair shop setting, where technicians often encounter a range of devices requiring reballing, from laptops to gaming consoles.
  • question: How does the reballing process work?

    répondre: The reballing process begins with the removal of the old BGA chip from the PCB. The IC is then cleaned, and a stencil is placed over it to apply new solder balls accurately. Once the solder paste is in place, the chip is aligned and heated using the rework station, causing the solder to melt and form strong connections. This careful process is vital for restoring functionality in electronic devices and is a key skill for electronics repair technicians.
  • question: Is it necessary to use solder paste with the BGA Reballing Station?

    répondre: Yes, using solder paste is essential during the BGA reballing process. Solder paste enhances the connection by providing the necessary solder balls at the contact points, ensuring a stronger bond when the BGA is reattached to the PCB. This process is important for maintaining effective electronic performance, decreasing the risk of future failures, and is commonly performed in professional repair environments.
  • question: What materials are recommended for use with the BGA Reballing Station?

    répondre: For optimal results, it’s recommended to use high-quality solder paste and a compatible stencil designed for the specific size of the BGA chip being reworked. Additionally, tools made from aluminum alloy for durability and precision are preferred. Using the right materials ensures that the reballing process is efficient and results in a reliable electrical connection, making it essential for repairs in critical electronic applications.
  • question: How do I maintain my BGA Reballing Rework Station?

    répondre: Maintaining your BGA Reballing Rework Station involves regular cleaning of the stencil and components to prevent residue buildup that can cause defects during reballing. Check the heating elements periodically to ensure consistent performance, and calibrate the machine based on usage to ensure accuracy. Proper maintenance extends the lifespan of the station and ensures high-quality repairs, making it a vital practice for repair professionals.
  • question: What are some common applications for a BGA Reballing Station?

    répondre: Common applications for a BGA Reballing Station include repairing circuit boards in laptops, gaming consoles, smartphones, and other electronic devices. It is widely used in service centers where electronic repairs are conducted, allowing technicians to restore functionality to devices that experience BGA failures. These applications highlight the tool's importance in the electronics repair industry, enabling efficient fixes and prolonged device life.
  • question: Can I use this station for other types of soldering tasks?

    répondre: While primarily designed for BGA reballing, the BGA Reballing Rework Station can be used for other soldering tasks as well, particularly those involving components with similar soldering requirements. However, for tasks such as through-hole soldering or intricate surface mount work, specialized tools may be more effective. This flexibility can be beneficial in a busy repair shop where various devices and components need attention.
  • question: Where can I buy BGA Reballing Rework Station?

    répondre: You can buy the BGA Reballing Rework Station on Ubuy in Togo. Ubuy offers a wide selection of soldering tools, including high-quality reballing stations and accessories for BGA IC reworking. With their competitive pricing and user-friendly platform, Ubuy makes it convenient for customers in Togo to find the right equipment for their electronics repair needs.

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XOF 30544

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Conforme PCI DSS et certifié ISO 27001:2022, avec des paiements chiffrés et une protection complète de l'acheteur pour chaque commande.

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Caractéristiques et avantages

  • High-quality aluminum alloy ensures lightness and durability.
  • Compatible with BGA chips from 9mm to 43mm for versatile use.
  • User-friendly design simplifies the manual soldering process.
  • Includes a diversion groove to improve efficiency and cleanliness.
  • Comes with a complete package including one BGA Reballing Station and hex wrench.
  • Ideal for notebook computer CPUs and mobile phone digital products rework.

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